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Heat Sink Compound Syringe - 20g Stock Number: ES1953243
A heat sink compound that enhances thermal conductivity and facilitates efficient heat dissipation in electronic components
Heat Sink Compound Syringe - 20g
The Kontakt Chemie Heat Sink Compound is a high-performance thermal paste that improves heat transfer between electronic components. It has excellent moisture resistance and low metallic impurity content, making it ideal for a wide range of applications.
Application:
- Printed circuit boards
- Electronic components
- Control assemblies
Directions:
- Apply it to a clean, dry surface.
- Do not mix with other products.
- Do not use on energized equipment.
Specification:
- Capacity: 20g
- High thermal conductivity
- Excellent moisture buffer
- Low metallic impurity content
- Operating temperature: -50°C to 300°C
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